Texas Instruments (TI) has unveiled new isolated power modules, helping enable increased power density, efficiency and safety in applications ranging from data centres to electric vehicles (EVs). The UCC34141-Q1 and UCC33420 isolated power modules leverage TI’s IsoShield technology, a proprietary multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs. TI is showcasing these innovations at the 2026 Applied Power Electronics Conference (APEC), March 23-26 in San Antonio, Texas.
“Packaging innovation is revolutionising the power industry, with power modules at the forefront of this transformation,” said Kannan Soundarapandian, vice president and general manager, High Voltage Products at TI. “TI’s new IsoShield technology delivers what power engineers need most: smaller solutions with improved efficiency and reliability, and a faster time to market. It is the latest example of TI’s continued commitment to advance power semiconductor technology to help solve today’s engineering challenges.”
Redefining power density with TI’s packaging technology
Historically, power designers have turned to power modules to conserve valuable board space and simplify the design process. As chip sizes reach their physical limits and miniaturisation increases in importance, advancements in packaging technology are enabling further performance and efficiency gains.
TI’s new IsoShield technology combines a high-performance planar transformer with an isolated power stage, offering functional, basic, and reinforced isolation capabilities. It enables a distributed power architecture, helping manufacturers meet functional safety requirements by avoiding single-point failures. The result is a packaging advancement that shrinks solution size by as much as 70% while delivering up to 2W of power, enabling compact, high-performance and reliable designs for automotive, industrial and data centre applications that require reinforced isolation.
Advancing data centre and EV performance through power innovations
Power density innovations are nowhere more critical than in today’s evolving data centre and automotive designs. Meeting design requirements in those applications starts with advanced analogue semiconductors – the components that enable smarter, more efficient operations. As global data centres continue to scale to meet exponentially growing demand, high-performance power modules must pack more power in smaller spaces. With TI’s IsoShield packaging technology, designers can achieve higher power density in compact form factors, ensuring reliable and safe operation of the world’s digital infrastructure. Similarly, the increased power density enabled by IsoShield technology helps engineers design lighter and more efficient EVs that significantly extend range and enhance performance.
Building on our power module innovation
For decades, TI has strategically invested in power management technology, with recent developments in power modules that feature integrated transformers and integrated inductors. Through innovative proprietary packaging solutions such as IsoShield and MagPack™ technologies, along with a comprehensive portfolio of over 350 power modules with optimised packages, TI’s semiconductors empower engineers to maximise performance in any power design or application.
Innovating what’s next in power at APEC 2026
In booth No. 1819 at the Henry B. González Convention Centre, TI will feature the isolated power modules with IsoShield technology in a high-power, high-performance automotive silicon carbide (SiC) 300kW traction inverter reference design. Additionally, TI will debut other advancements in data centers, automotive, humanoid robots, sustainable energy and USB Type-C® applications, including an 800V to 6V DC/DC power distribution board. This design features TI’s portfolio of gallium nitride integrated power stages, digital isolators and microcontrollers that help enable high efficiency and power density in power conversion for next-generation data center computing trays with AI processors.
