HomeNewsVicor to Celebrate Opening of the Industry’s first “ChiP” fab

    Vicor to Celebrate Opening of the Industry’s first “ChiP” fab

    State and local officials celebrated the opening of a new, state‑of‑the‑art power module manufacturing facility. The world’s first ChiP (Converter housed in Package) fabrication facility, or “ChiP fab” enables scalable, automated, cost-effective manufacturing of power modules in the United States.

    At 400 Federal Street, at 10:00 am on May 18th, 2022, Vicor employees and senior management were joined by state and local government representatives.

    With its new ChiP foundry, Vicor takes a major step toward realizing its vision to enable high‑performance, modular power system solutions capable of satisfying demanding power requirements.

    “Our new ChiP fab integrates all of the process steps necessary to manufacture high‑density power modules in wafer-like panels with short cycle time and flexible capacity,” said Mike McNamara, Vicor Vice President of Operations.

    A leader in innovation with a track record of US manufacturing

    The new facility comes online as Vicor celebrates 41 years of expanding its performance leadership within the global power electronics industry with U.S.-based manufacturing.

    The new, vertically-integrated ChiP fab utilizes patented fabrication processes that further differentiate Vicor power modules by enabling the most power-dense and energy-efficient solutions.

    ChiP
    Vicor ChiPs are manufactured in panels utilizing process steps analogous to semiconductor wafer fabs
    ELE Times News
    ELE Times Newshttps://www.eletimes.ai/
    ELE Times provides extensive global coverage of Electronics, Technology, and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified, and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads, and market your products favorably.

    Related News

    Must Read

    Kyocera and Rohde & Schwarz’s multipurpose phased array antenna module (PAAM) at CES 2026

    Kyocera and Rohde & Schwarz will demonstrate the characterization...

    AI PCs: What Tata Electronics and Intel Aim to Scale in India

    Tata Electronics, a global enterprise headquartered in India, and...

    UP’s Semiconductor Push: State to Build Three New Electronics Hubs Beyond NCR

    With an aim to boost development and employment beyond...

    One Nation, One Compute Grid: India’s Leap into the AI and Supercomputing Era

    Courtesy: Dr. Harilal Bhaskar, Chief Operating Officer (COO) and...

    New, Imaginative AI-enabled satellite applications through Spacechips

    As the demand for smaller satellites with sophisticated computational...

    Beyond the Bill: How AI-Enabled Smart Meters Are Driving Lead Time Optimization and Supply Chain Resilience in the Energy Grid

    Introduction Smart meters have significantly evolved since their initial implementation...

    Inside the Digital Twin: How AI is Building Virtual Fabs to Prevent Trillion-Dollar Mistakes

    Introduction Semiconductor manufacturing often feels like modern alchemy: billions of...