HomeLatest ProductsInfineon introduces XENSIV TLE4802SC16-S0000 with inductive sensing for higher accuracy and performance

    Infineon introduces XENSIV TLE4802SC16-S0000 with inductive sensing for higher accuracy and performance

    Infineon Technologies AG is launching the XENSIV TLE4802SC16-S0000, an inductive sensor designed to enhance performance in automotive chassis applications. The sensor enables high-precision torque and angle measurements with robust stray field robustness, supporting digital output via SENT or SPC protocols. It achieves highly accurate sensing without needing additional shielding. Tailored for use in electric power steering systems, including torque and steering angle sensors, as well as pedal and suspension applications, the sensor offers both flexibility and reliability.

    The XENSIV TLE4802SC16-S0000 combines a coil system driver, signal conditioning circuits, and a digital signal processor (DSP) in a single package. The sensor includes overvoltage and reverse polarity protection and comes in a RoHS-compliant and halogen-free surface-mounted TSSOP-16 package. It is qualified to AECQ100, Grade 0, for operation across a wide temperature range from -40°C to 150°C. Furthermore, the sensor is fully compliant with ISO 26262, making it ideal for safety-critical systems. A built-in cybersecurity function protects the system communications against man-in-the-middle attacks. The TLE4802SC16-S0000 is the first in a new family of inductive sensors, with further variants planned for release.

    Related News

    Must Read

    Keysight to Demonstrate NR-NTN devices Mobility Testing at MWC 2026 in Collaboration with Samsung

    Keysight Technologies, Inc. will demonstrate lab-based validation of new...

    ROHM Strengthens Supply Capability for GaN Power Devices

    Combining TSMC’s Process Technology to Build an End-to-End, In-Group...

    element14 Community launches smart security and surveillance design challenge

    element14, an Avnet Community, in collaboration with ADI, has...

    R & S and LITEON demonstrate high‑throughput 5G femtocell testing with the PVT360A

    Rohde & Schwarz and LITEON collaborate to showcase a...

    Infineon presents MCU and sensor solutions for the future of AI, IoT, mobility, and robotics

    Next-generation embedded systems are essential for applications in the...

    R&S advances AI-RAN testing using digital twins in collaboration with NVIDIA

    Rohde & Schwarz will showcase a new milestone in...

    Top Seven Tech Trends in the semiconductor sector for 2026

    By: STMicroelectronics In 2026, a new class of intelligent machines...