HomeNewsIndia NewsNew Contract Chip Manufacturing Division Samsung Semiconductors

    New Contract Chip Manufacturing Division Samsung Semiconductors

    Samsung Electronics Co Ltd. Has recently formed a new division within its semiconductor business exclusively for contract chip manufacturing, as the firm aims to attract more customers.

    The new division will be responsible for making mobile processors and other non-memory chips for clients such as Qualcomm Inc and Nvidia Corp, competing with firms such as Taiwan Semiconductor Manufacturing Co.

    It will continue to be overseen by Kim Ki-nam, Samsung’s president overseeing all chip businesses.

    The move is unlikely to surprise. Analysts had speculated that the firm would eventually split apart its foundry and system chip operations to make them more efficient and ease concerns from customers about potential leaks to parts of Samsung that compete with them.

    Although revenue from the foundry business remains a small portion of Samsung’s overall sales, it has seen sharp growth. Research firm IHS estimates Samsung’s foundry revenue rose 86 percent to $4.7 billion in 2016.

     

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Keysight Hosts AI Thought Leadership Conclave in Bengaluru

     Keysight Technologies, Inc. announced the AI Thought Leadership Conclave, a...

    Government approves 17 projects worth Rs. 7,172 crore under ECMS

    The Ministry of Electronics and IT announced for the...

    BD Soft strengthens cybersecurity offerings for BFSI and Fintech businesses with advanced solutions

    BD Software Distribution Pvt. Ltd. has expanded its Managed...

    Advancing Quantum Computing R&D through Simulation

    Courtesy: Synopsys Even as we push forward into new frontiers...

    Overcoming BEOL Patterning Challenges at the 3-NM Node

    Courtesy: Lam Research ● Controlling critical process parameters is key...

    Driving Innovation with High-Performance but Low-Power Multi-Core MCUs

    Courtesy: Renesas Over the last decade, the number of connected...

    Evolving from IoT to edge AI system development

    Courtesy: Avnet The advancement of machine learning (ML) along with...

    From the grid to the gate: Powering the third energy revolution

    Courtesy: Taylor, Robert, Mannesson, Henrik, Texas Instruments A significant change...

    Rohde & Schwarz India Pvt. Ltd. unveils R&D Centre in New Delhi, India

    Rohde & Schwarz announced the expansion of its Research...

    Rohde & Schwarz presents multi-purpose R&S NGT3600 high-precision dual-channel power supply

    Rohde & Schwarz showcases at productronica 2025 the R&S...