HomeElectronicsSemiconductors and ChipsRX23E-A IO-Link ready-to-use bi-directional communication reference solution

    RX23E-A IO-Link ready-to-use bi-directional communication reference solution

    industrial automation, as well as demand for remote maintenance management of equipment due to the impact of the COIVD 19 pandemic. The most common way of data collection from is to have a one-way direct communication to send data to the upper-level devices. With the number of equipment to be installed has multiplied and at wide coverage of area, this is posing an increase in the cost to introduce new communication protocol to original wiring.

    To minimize this additional cost impact, I am going to introduce a relatively low-cost, bi-directional 3-wire IO-Link communication, which can be implemented in small space and has been used for such equipment.

    Renesas proposes IO-Link for Temperature Controller solution based on 32-bit RX23E-A MCU, which realizes temperature measurement using on-chip high-precision Analog Front End for signals processing, and communication control via IO-Link PHY within a single chip.

    The integration of analog and MCU function in 1 chip help reducing board size significantly. This solution also contributes to reducing investigation time at the beginning of the development by providing application note, sample program with protocol stack, BOM, circuit diagram, all are easily downloadable from Renesas’s website.

    IO-Link Communication Structure Diagram

    IO-Link Communication Structure Diagram

    Details of Solution Structure

    Details of Solution Structure

    Below is a picture of our demo kit running the sample program, which is operating real-time threshold update from the upper layer. Users can easily test the bi-directional communication, which is one of the advantages of IO-Link communication.

    Bi-directional communication demo

    Bi-directional communication demo

    With this solution, you can build your own IO-Link evaluation environment easily. This solution has been published on the web as an application note, “RX23E-A Group Example of IO-Link device (temperature sensor) “(document No: R01AN5676eJ0100).  In addition, peripheral parts and other related components have been introduced on our Winning Combination webpage. Please refer to these materials during initial examination of space-constraints IO-Link communication.

    Related News

    Must Read

    Qualitas Semiconductor Picks Anritsu’s Vector Network Analyzer for High-Speed Interconnect Signal Integrity Verification

    Qualitas Semiconductor Co., Ltd., a leading developer specialising in...

    The Tomorrow for AI and India’s edge advantage

    Courtesy: Qualcomm Artificial intelligence is entering its next chapter, one...

    Posifa Technologies Introduces PVC4001-C MEMS Pirani Vacuum Transducer for Wide-Range Vacuum Measurement

    Posifa Technologies has introduced its new PVC4001-C MEMS Pirani vacuum...

    STMicroelectronics to support AI infrastructure demand with high-volume production of its industry-leading silicon photonics platform

    STMicroelectronics is now entering high-volume production for its state-of-the-art...

    Impact of AI on Computing and the Criticality of Testing

    Courtesy: Teradyne Artificial intelligence (AI) is transforming industries, enhancing our...

    Disruptions from Wide Bandgap Continue Turbulence

    Courtesy: Avnet When we experience major shifts in the technology...

    Securing Humanoid Robotics with TPM-Anchored FPGAs

    Courtesy: Lattice Semiconductor The humanoid robotics market is rapidly transitioning...

    Keysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI Data Centres

    Keysight Technologies, Inc. introduced the Functional Interconnect Test Solutions (FITS) portfolio...

    CEA-Leti and NcodiN Collaborate on 300 mm Silicon Photonics for Bandwidth-Consuming AI Interconnects

    CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled...