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STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced that Rias Al-Kadi, General Manager of the Company’s Range and...

STARLight Project chosen as the European consortium to lead in next-gen silicon photonics on 300 mm wafers

The STARLight project is bringing together a consortium of leading industrial and academic partners to position Europe as a technology leader in 300mm silicon photonics...

KYOCERA AVX RELEASES NEW KGP SERIES STACKED CAPACITORS

KYOCERA AVX released the new KGP Series commercial-grade stacked capacitors for high-frequency applications in the industrial and downhole oil and gas industries. The new commercial-grade...

Microchip Unveils First 3 nm PCIe Gen 6 Switch to Power Modern AI Infrastructure

Switchtec Gen 6 PCIe Fanout Switches deliver extra bandwidth, low latency and advanced security for high-performance compute, cloud computing and hyperscale data centers As artificial...

Nuvoton Launches Arbel NPCM8mnx System-in-Package (SiP) for AI Servers and Datacenter Infrastructure

Breakthrough BMC Innovation Powers Secure, Scalable, and Open Compute Platforms Nuvoton Technology Corporation announced the launch of the Arbel NPCM8mnx System-in-Package (SiP) — a compact,...

NEPCON ASIA 2025: Showcasing the Future of Smart Electronics Manufacturing

NEPCON ASIA 2025, taking place from October 28 to 30 at the Shenzhen World Exhibition & Convention Center, is set to deliver an unparalleled...

Renesas Expands Sensing Portfolio with 3 Magnet-Free IPS ICs & Web-Based Design Tool

New Simulation & Optimization Platform Enables Custom Coil Designs for Industrial, Robotics and Medical Systems Renesas Electronics Corporation introduced a new family of magnet-free inductive position...

IEEE IEDM, 2025 Showcases Latest Technologies in Microelectronics, Themed “100 Years of FETs”

The IEEE International Electron Devices Meeting (IEDM) is considered the premier forum where scientists and engineers come together to disclose, discuss, and debate the...

OMNIVISION Introduces Next-Generation 8-MP Image Sensor For Exterior Automotive Cameras

OMNIVISION announced its latest-generation automotive image sensor: the OX08D20, 8-megapixel (MP) CMOS image sensor with TheiaCel technology. This new device is an upgrade to the popular OX08D10 sensor for exterior...

OMNIVISION Announces Automotive Industry’s First Global Shutter HDR Sensor for In-Cabin Driver and Occupant Monitoring Systems

OMNIVISION launched the latest addition to its popular Nyxel near-infrared (NIR) technology family: the new OX05C—the automotive industry’s first and only 5-megapixel (MP) back-side illuminated...

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