HomeNewsIndia NewsNew horizontal mount chassis facilitates multiple backplane architectures

New horizontal mount chassis facilitates multiple backplane architectures

Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a highly versatile 5.25” tall chassis that accepts 3U or 6U boards mounted horizontally of various backplane types.

With Pixus’ modular design that accepts various card guide and rail options, one can incorporate OpenVPX, cPCI Serial, VME64x or other Eurocard architectures in the new horizontal mount chassis.  The chassis typically accepts up to six 6U modules at a 0.8” pitch or five 6U modules at 1.0” pitch.   A divider can be placed to split the opening to accept dual rows of 3U modules or a mix of 3U and 6U boards.

The chassis supports multiple pluggable (or fixed) power supplies in various voltage/wattage options. Side-to-side cooling is standard, but front-to-rear versions are available upon request.

Pixus offers OpenVPX backplanes, chassis platforms, and specialty products.  The company also provides enclosure solutions in MicroTCA, cPCI Serial, AdvancedTCA, as well as instrumentation case formats.

For more information, visit: www.pixustechnologies.com 

ELE Times Research Desk
ELE Times Research Deskhttps://www.eletimes.ai
ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

Related News

Must Read

Keysight Introduces RF Signal Analyzers

New analyzers help engineers capture more signal behavior with...

Murata Brings 3D EM and Thermal Simulation Models to Ansys

Murata Manufacturing Co., Ltd. announces a new collaboration with...

Microchip’s Nantes Facility Achieves QML Class Y Certification

Microchip Technology announces that its Nantes facility in France expands...

Vishay Intertechnology Releases New 1 A, 2 A, and 3 A Gen 7 1200 V FRED Pt Hyperfast Rectifiers in SMPC HV Package

Reducing Switching Losses and Increasing Efficiency, Devices Combine Low...

Rohde  and Schwarz Leads GCF 3GPP NR-NTN Validation with Record Test Cases

Rohde & Schwarz is driving the commercialization of 5G-based...

ROHM Launches AG16xFNxx Series MOSFETs for Automotive 48V Power Supply Systems

ROHM develops the “AG16xFNxx Series,” a lineup of 80V...

STMicroelectronics High-Performance Vibration Sensor offers an alternative to Piezosensors

Industrial-grade vibration sensor delivers the latest wide-bandwidth and...

Bosch Accelerates Automation and Robotics Drive

Advance robotics and the dynamic growth of humanoid systems...

AI server Boards are Boosting at ASMPT SMT Solutions

Solutions, a global technology manufacturer of hardware and software....

Bosch Introduces Third-Gen Silicon Carbide Chips for EV

As India accelerates its transition to electric mobility, the...