HomeLatest ProductsInfineon expands its GaN power portfolio with EasyPACK CoolGaN power modules for...

Infineon expands its GaN power portfolio with EasyPACK CoolGaN power modules for high-voltage applications

With the rapid growth of AI data centers, the increasing adoption of electric vehicles, and the ongoing trends in global digitalization and reindustrialization, global electricity demand is expected to surge. To address this challenge, Infineon Technologies AG is introducing the EasyPACK CoolGaN Transistor 650 V module, adding to its growing GaN power portfolio. Based on the Easy Power Module platform, the module has been specifically developed for high-power applications such as data centers, renewable energy systems, and DC electric vehicle charging stations. It is designed to meet the growing demand for higher performance while providing maximum ease of use, helping customers accelerate their design processes, and shorten time to market.

“The CoolGaN based EasyPACK power modules combine Infineon’s expertise in power semiconductors and power modules,” says Roland Ott, Senior Vice President and Head of the Green Energy Modules and Systems Business Unit at Infineon. “This combination offers customers a solution that meets the increasing demand for high-performance and energy-efficient technologies in applications such as data centers, renewable energy, and EV charging.”

The EasyPACK CoolGaN module integrates 650 V CoolGaN power semiconductors with low parasitic inductances, achieved through compact die packing enabling fast and efficient switching. Delivering up to 70 kW per phase with just a single module, the design supports compact and scalable high-power systems. Furthermore, by combining Infineon’s .XT interconnect technology with CoolGaN options, the module enhances both performance and reliability. The .XT technology is implemented on a high-performance substrate, significantly reducing thermal resistance, which in turn translates to higher system efficiency and lower cooling demands. This results in increased power density and excellent cycling robustness, even under demanding operating conditions. With support for a broad range of topologies and customization options, the EasyPACK CoolGaN module addresses diverse requirements in industrial and energy applications.

Related News

Must Read

L&T Technology Services Global EI Hackathon Sparks the Next Wave of AI-Native Engineering Solutions

L&T Technology Services, a global leader in Engineering Intelligence...

Keysight Targets the Hidden Cost of UI Test Authoring and Maintenance

Keysight Technologies today announced Keysight Eggplant Find by Description,...

Infineon Launches SECORA ID Key S USB Security Solution

Infineon Technologies AG has launched the SECORA ID Key...

Infineon Receives Additional Prestigious Award for Outstanding Investor Relations Work

DIRK (German Investor Relations Association) awards Infineon first...

STMicroelectronics Unveils World’s First ST54M Secure Mobile Chip With Post-Quantum Cryptography

Advance single-die solution with PQC (post-quantum cryptography) hardware...

Portronics launches VlogMate Neo: Mini Type-C Wireless Microphone with AI Feature

Featuring AI-powered noise reduction, real-time audio transmission, compact lightweight...

Nuvoton Unveils New Cortex-M23 Microcontroller SOC, NSC128L42, for High-Precision Measurement Applications

Nuvoton Technology Corporation announces the launch of the NSC128L42,...

New Battery Breakthrough Leads to ‘Big Leaps’ in Electronic Performance

A breakthrough could lead to huge breakthroughs in battery...