HomeNewsIndia NewsLatest twist in sales of world's second-biggest flash memory chipmaker

    Latest twist in sales of world’s second-biggest flash memory chipmaker

    Apple is considering teaming up with its supplier Foxconn to bid for Toshiba’s semiconductor business, the news coming on March 14, 2017.

    Apple is considering investing at least several billion dollars to take a stake of more than 20 per cent in a plan that would have Toshiba maintain a partial stake to keep the business under US and Japanese control, came in reports.

    The proposal is aimed at allaying the Japanese government’s concerns over any transfer of sensitive technology to investors it deems a risk to national security, it said.

    Apple was not immediate available to comment. Taiwan’s Foxconn, formally known as Hon Hai Precision Industry, declined to comment.

    The report comes as Western Digital Corp, Toshiba’s partner and one of the bidders of its chip business, warned this week that the Japanese firm is violating a joint venture contract in plans to sell to its chip unit, and urged that it be given exclusive negotiating rights.

    Toshiba has narrowed down the field of bidders for its chip unit to four suitors, sources have said previously.

    They are US chip maker Broadcom, which has partnered with private equity firm Silver Lake Partners LP; South Korean chip maker SK Hynix; Foxconn, the world’s largest contract electronics maker, and Western Digital.

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Nuvoton Launches Arbel NPCM8mnx System-in-Package (SiP) for AI Servers and Datacenter Infrastructure

    Breakthrough BMC Innovation Powers Secure, Scalable, and Open Compute...

    STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption

    STMicroelectronics has announced that Rias Al-Kadi, General Manager of the...

    NEPCON ASIA 2025: Showcasing the Future of Smart Electronics Manufacturing

    NEPCON ASIA 2025, taking place from October 28 to...

    Renesas Expands Sensing Portfolio with 3 Magnet-Free IPS ICs & Web-Based Design Tool

    New Simulation & Optimization Platform Enables Custom Coil Designs...

    IEEE IEDM, 2025 Showcases Latest Technologies in Microelectronics, Themed “100 Years of FETs”

    The IEEE International Electron Devices Meeting (IEDM) is considered...

    OMNIVISION Introduces Next-Generation 8-MP Image Sensor For Exterior Automotive Cameras

    OMNIVISION announced its latest-generation automotive image sensor: the OX08D20, 8-megapixel (MP) CMOS...

    Vishay Intertechnology Expands Inductor Portfolio with 2000+ New SKUs and Increased Capacity

    Vishay Intertechnology, Inc. announced that it has successfully delivered...

    Keysight to Demonstrate AI-enabled 6G and Wireless Technologies at India Mobile Congress 2025

    Keysight Technologies will demonstrate 20 advanced AI-enabled 6G and...

    Ashwini Vaishnaw Approves NaMo Semiconductor Lab at IIT Bhubaneswar

    As part of a big push towards the development...