HomeNewsIndia NewsLatest twist in sales of world's second-biggest flash memory chipmaker

Latest twist in sales of world’s second-biggest flash memory chipmaker

Apple is considering teaming up with its supplier Foxconn to bid for Toshiba’s semiconductor business, the news coming on March 14, 2017.

Apple is considering investing at least several billion dollars to take a stake of more than 20 per cent in a plan that would have Toshiba maintain a partial stake to keep the business under US and Japanese control, came in reports.

The proposal is aimed at allaying the Japanese government’s concerns over any transfer of sensitive technology to investors it deems a risk to national security, it said.

Apple was not immediate available to comment. Taiwan’s Foxconn, formally known as Hon Hai Precision Industry, declined to comment.

The report comes as Western Digital Corp, Toshiba’s partner and one of the bidders of its chip business, warned this week that the Japanese firm is violating a joint venture contract in plans to sell to its chip unit, and urged that it be given exclusive negotiating rights.

Toshiba has narrowed down the field of bidders for its chip unit to four suitors, sources have said previously.

They are US chip maker Broadcom, which has partnered with private equity firm Silver Lake Partners LP; South Korean chip maker SK Hynix; Foxconn, the world’s largest contract electronics maker, and Western Digital.

ELE Times Bureau
ELE Times Bureauhttps://www.eletimes.ai/
ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

Related News

Must Read

Keysight Introduces RF Signal Analyzers

New analyzers help engineers capture more signal behavior with...

Murata Brings 3D EM and Thermal Simulation Models to Ansys

Murata Manufacturing Co., Ltd. announces a new collaboration with...

Microchip’s Nantes Facility Achieves QML Class Y Certification

Microchip Technology announces that its Nantes facility in France expands...

Vishay Intertechnology Releases New 1 A, 2 A, and 3 A Gen 7 1200 V FRED Pt Hyperfast Rectifiers in SMPC HV Package

Reducing Switching Losses and Increasing Efficiency, Devices Combine Low...

Rohde  and Schwarz Leads GCF 3GPP NR-NTN Validation with Record Test Cases

Rohde & Schwarz is driving the commercialization of 5G-based...

ROHM Launches AG16xFNxx Series MOSFETs for Automotive 48V Power Supply Systems

ROHM develops the “AG16xFNxx Series,” a lineup of 80V...

STMicroelectronics High-Performance Vibration Sensor offers an alternative to Piezosensors

Industrial-grade vibration sensor delivers the latest wide-bandwidth and...

Bosch Accelerates Automation and Robotics Drive

Advance robotics and the dynamic growth of humanoid systems...

AI server Boards are Boosting at ASMPT SMT Solutions

Solutions, a global technology manufacturer of hardware and software....

Bosch Introduces Third-Gen Silicon Carbide Chips for EV

As India accelerates its transition to electric mobility, the...