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Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

 Keysight Technologies introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D...

Jodi Shelton, CEO of GSA – Launches A Bit Personal, a New Podcast Offering Rare,...

Jodi Shelton, Co-Founder and CEO of the Global Semiconductor Alliance and Shelton Group, announced the launch of A Bit Personal, a new leadership-focused podcast that pulls back...

ROHM’s New Compact, Highly Reliable Package Added to Automotive 40V/60V MOSFET Lineup

ROHM has expanded its lineup of low-voltage (40V/60V) MOSFETs for automotive applications – such as main inverter control circuits, electric pumps, and LED headlights...

IIIT Hyderabad’s Smart Approach To Sand Mining Enforcement, Incorporating AI in Trucks

‘Truck art’ or the hand-painted ‘Horn Ok Please’, ‘Use Dipper at Night’ and the ‘Buri nazar waale tera mooh kala’ are an integral part...

Applied Materials, CG Power, Lam Research, Larsen & Toubro, and Micron Join the IDTA

The India Deep Tech Alliance (IDTA) announced that Applied Materials, CG Power, Lam Research, Larsen & Toubro, and Micron Technology have joined the Alliance....

IIIT Hyderabad’s customised chip design and millimetre-wave circuits for privacy-preserving sensing and intelligent healthcare systems

In an age where governance, healthcare and mobility increasingly rely on data, how that data is sensed, processed and protected matters deeply. Visual dashboards,...

ElevateX 2026, Marking a New Chapter in Human Centric and Intelligent Automation

Teradyne Robotics today hosted ElevateX 2026 in Bengaluru - its flagship industry forum bringing together Universal Robots (UR) and Mobile Industrial Robots (MiR) to...

Govt Bets Big on Chips: India Semiconductor Mission 2.0 Gets ₹1,000 Crore Funding

In a significant push for the nation’s tech ambitions, the Government of India has earmarked Rs. 1,000 crores for the India Semiconductor Mission (ISM)...

Microchip and Hyundai Collaborate, Exploring 10BASE-T1S SPE for Future Automotive Connectivity 

Microchip Technology announced a collaboration with Hyundai Motor Group (HMG) to explore the adoption of advanced in-vehicle network solutions based on 10BASE-T1S Single Pair...

Microchip Extends its Edge AI Solutions for Development of Production-ready Applications using its MCUs &...

A major next step for artificial intelligence (AI) and machine learning (ML) innovation is moving ML models from the cloud to the edge for...

Anritsu Launches New RF Hardware Option, Supporting 6G FR3 

Anritsu Corporation released a new RF hardware option for its Radio Communication Test Station MT8000A to support the key FR3 (Frequency Range 3) frequency...

Anritsu Achieves Skylo Certification to Accelerate Global Expansion for NTNs

ANRITSU CORPORATION announced the expansion of its collaboration with Skylo Technologies with the successful certification of Anritsu’s RF and protocol test cases for Skylo’s non-terrestrial...

Arrow Electronics Initiates Support for Next-Gen Vehicle E/E Architecture

Arrow Electronics has launched a strategic initiative and research hub to support next-generation vehicle electrical and electronic (E/E) architecture. The available resources provide automotive manufacturers...

TOYOTA Selects Infineon’s SiC Power Semiconductors for its New, “bZ4X”

Infineon Technologies announced that CoolSiC MOSFETs (silicon carbide (SiC) power MOSFETs) have been adopted in the new bZ4X model from Toyota, the world's largest...

STMicroelectronics expands strategic engagement with AWS, enabling high-performance compute infrastructure for cloud and AI data

STMicroelectronics has announced an expanded strategic collaboration with Amazon Web Services (AWS) through a multi-year, multi-billion USD commercial engagement serving several product categories. The...

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