HomeNewsIndia NewsNI’s Time Sensitive Networking (TSN) Into the CompactDAQ Platform for resolving Networking...

    NI’s Time Sensitive Networking (TSN) Into the CompactDAQ Platform for resolving Networking issue

    NI the provider of platform-based systems that enable engineers and scientists to solve the world’s greatest engineering challenges, announced the release of two new multislot Ethernet chassis. The cDAQ-9185 and cDAQ-9189 introduce new time-based synchronization built on the latest Ethernet standards, furthering NI’s efforts in Time Sensitive Networking (TSN) and rugged CompactDAQ hardware for distributed measurements.

    The nature of physical systems test is rapidly changing as measurement systems migrate from the control room to closer to the device under test. While this shortens installation time, reduces the cost of sensor wiring and improves measurement accuracy, it creates challenges with synchronization and systems management, especially using today’s industrial networking technologies. NI is actively working to help define TSN, the next evolution of the IEEE 802.1 Ethernet standard, to deliver distributed time synchronization, low latency and convergence of time critical and general networking traffic. The cDAQ-9185 and cDAQ-9189 provide tight time synchronization with TSN to simplify and improve scalability of synchronized, distributed systems. Features and benefits include:

    • Precise synchronized timing over the network, which eliminates the need for lengthy, physical timing cables and ensures tightly synchronized measurements for accurate analysis.
    • Simple daisy chaining through an integrated network switch for quick setup and expansion in distributed applications.
    • Reliable operation in harsh environments with -40° to 70° C operating temperature range, shock resistance up to 50 g and vibration resistance up to 5 g.
    • Software abstraction through the NI-DAQmx driver that automatically synchronizes multiple chassis for simple programming.

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Rohde & Schwarz, together with Samsung, first to validate 3GPP NR-NTN conformance across RF, RRM and PCT

    Rohde & Schwarz and Samsung are collaborating to bring...

    Microchip introduces edge-enabling LAN866x 10BASE-T1S ethernet for SDVs

    As the automotive industry transitions to zonal architectures for...

    New Vishay Intertechnology Silicon PIN Photodiode for Biomedical Applications

    Vishay Intertechnology, Inc. introduced a new high speed silicon...

    The Invisible Hand: How Smart Technology Reshaped the RF and Microwave Development Track

    The world is not just connected; it is smart,...

    Nuvoton Technology Launches NuMicro M5531 Series Microcontrollers

    Nuvoton Technology announced the launch of NuMicro M5531 series...

    STMicroelectronics empowers data-hungry industrial transformation with unique dual-range motion sensor

    STMicroelectronics has revealed the ISM6HG256X, a tiny three-in-one motion...

    How AI Is Powering the Road to Level 4 Autonomous Driving

    Courtesy: Nvidia When the Society of Automotive Engineers established its...

    Revolutionizing System Design with AI-Powered Real-Time Simulation

    Courtesy: Cadence The rising demand for AI infrastructure is driving...

    Microchip Technology Expands its India Footprint with a New Office Facility in Bengaluru

    Microchip Technology has expanded its India footprint with the...