HomeIndustryAutomotiveSTMicroelectronics and Virscient Collaborate to Enable Faster Delivery of Connected-Car Systems

    STMicroelectronics and Virscient Collaborate to Enable Faster Delivery of Connected-Car Systems

    STMicroelectronics has joined forces with Virscient, a provider of hardware and software development services and support for customers building automotive solutions using ST’s Telemaco3P secure telematics and connectivity processors.

    Virscient offers support to ST customers in the development and delivery of advanced automotive applications based on the ST Modular Telematics Platform (MTP). MTP is a comprehensive development and demonstration platform incorporating ST’s Telemaco3P telematics and connectivity microprocessor. MTP enables the rapid prototyping and development of smart-driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles. Virscient brings a deep understanding of wireless connectivity technologies and protocols ideal for architecting connected-car systems that rely on technologies such as GNSS (Precise Positioning), LTE/cellular modems, V2X technologies, Wi‑Fi, Bluetooth, and Bluetooth Low Energy.

    The Telemaco3P incorporates dual Arm Cortex-A7 processors with an embedded Hardware Security Module (HSM), an independent Arm Cortex-M3 subsystem, and a rich set of connectivity interfaces. With security at its core, and considerable flexibility in both hardware and software configurations, the Telemaco3P provides an excellent platform for connectivity within the vehicular environment.

    “We chose to collaborate with Virscient for Telemaco3P-based designs because of their differentiated expertise in the development of embedded systems and wireless technologies, and their proven track record of helping customers take connected products from concept to market,” said Philippe Prats, Head of EMEA Marketing and Application for STMicroelectronics’ Automotive and Discrete products. “The Telemaco3P platform enables our customers to deliver new categories and products in automotive telematics. By working with Virscient, we make this exciting technology accessible to a broader range of innovative companies.”

    Commenting on the collaboration, Dr. Murray Pearson, CEO of Virscient, said, “We’re thrilled to work with STMicroelectronics to enable more companies to deliver innovative and market-leading platforms using the Telemaco3P devices.”

    “ST and Telemaco3P are setting the security standard for processor and connectivity solutions in vehicular telematics. By leveraging Virscient’s hardware and software development capabilities, and our considerable experience with embedded wireless and connectivity technologies, Telemaco3P customers can push the envelope, and get their products to market quicker than ever.”

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Building Reliable 5G and 6G Networks Through Mobile Network Testing

    The development of communication networks has entered a revolutionary...

    Beyond the Screen: envisioning a giant leap forward for smartphones from physical objects to immersive experiences

    Author: STMicroelectronics Smartphones have become some of the most ubiquitous...

    Microchip’s SkyWire Tech Enables Nanosecond-Level Clock Sync Across Locations

    To protect critical infrastructure systems, SkyWire technology enables highly...

    Next Generation Hybrid Systems Transforming Vehicles

    The global automotive industry is undergoing a fundamental transformation...

    Tobii and STMicroelectronics enter mass production of breakthrough interior sensing technology

    Tobii and STMicroelectronics announced the beginning of mass production...

    Rohde & Schwarz unveils compact MXO 3 oscilloscopes with 4 and 8 channels

    Rohde & Schwarz expands its next-generation MXO oscilloscope portfolio...

    TI’s new power-management solutions enable scalable AI infrastructures

    Texas Instruments (TI) debuted new design resources and power-management...

    ESA awards Rohde & Schwarz for contributions to 30 years European Satellite Navigation

    The event brought together institutional and industrial partners, ESA...