HomeIndustryAutomotiveSynchronous buck converter enables efficiency and simplifies power-supply design

    Synchronous buck converter enables efficiency and simplifies power-supply design

    Texas Instruments (TI) introduced a wide-input-voltage (VIN) synchronous DC/DC buck converter with the industry’s best combination of light load efficiency, ease of design and overall power solution cost. The 100-V, 1-A LM5164 step-down voltage converter shrinks board space in rugged battery-powered industrial and automotive power supplies. Used in conjunction with TI’s WEBENCH Power Designer, this new DC/DC converter can enable simpler, faster power conversion design.

    TI will demonstrate the LM5164 buck converter along with the LM5180 primary-side regulated flyback converter in booth No. 511 at the Applied Power Electronics Conference (APEC) in Anaheim, California, March 18-20, 2019.

    The LM5164 is an easy-to-use, ultra-low quiescent current (IQ) synchronous step-down buck regulator that features a constant on-time (COT) control architecture and integrates high- and low-side power MOSFETs. The highly efficient buck converter operates from a wide input voltage of 6 V to 100 V and delivers up to a 1-A DC load current. The COT architecture requires no external compensation, while an internal VCC bias supply and bootstrap diode eliminates an additional capacitor.

    The LM5164 and LM5164-Q1 join TI’s portfolio of highly integrated, wide VIN DC/DC converters that enable designers to maximize power delivery in the smallest package possible.

    Key features and benefits of the LM5164

    • Shrink board space: The new device’s thermally efficient, small-outline integrated circuit (SOIC) PowerPAD package measures 5 mm by 6 mm, which is 30 percent smaller than competitive offerings. Designers can use the LM5164 to create a complete power-supply design in 105 mm2, which is more than 10 percent smaller than competitive offerings.
    • Highest light load efficiency:The LM5164 offers very low 10-µA typical standby quiescent current. This enables 10 percent better light load efficiency for 24-V to 5-V conversions with a 1-mA load and extends battery life compared to competitive solutions.
    • Simple, cost-effective design:A standard 8-pin SOIC package, few external components and WEBENCH Power Designer simplify design and reduce cost.

    Pricing and availability

    Available through the TI store and authorized distributors, the 100-V LM5164 and LM5164-Q1 are priced in small reels at US$1.53 and US$2.04, respectively, for 1,000-unit quantities. TheLM5164-Q1EVM-041 evaluation module is available for US$75.

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    Toxics Link study Finds a Long Road to Circularity in India’s E-waste EPR Model

    A new report by an environmental group, Toxics Link,...

    ESGDS’ AI platform slashes data processing time by 98% with MongoDB Atlas

    ESG Data & Solutions (ESGDS) is a fast-growing Indian...

    Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

     Keysight Technologies introduced 3D Interconnect Designer, a new addition to...

    Jodi Shelton, CEO of GSA – Launches A Bit Personal, a New Podcast Offering Rare, Candid Conversations with the Most Powerful Tech Leaders

    Jodi Shelton, Co-Founder and CEO of the Global Semiconductor Alliance and Shelton...

    Is SDV Really an Automotive or Just A Software-based machine That Moves?

    Speaking at the Auto EV Tech Vision Summit 2025,...

    ROHM’s New Compact, Highly Reliable Package Added to Automotive 40V/60V MOSFET Lineup

    ROHM has expanded its lineup of low-voltage (40V/60V) MOSFETs...

    The Rise of the AgentEngineer: How AI is Orchestrating the Future of Chip Design

    While traditional Electronic Design Automation tools have been faithfully...

    IIIT Hyderabad’s Smart Approach To Sand Mining Enforcement, Incorporating AI in Trucks

    ‘Truck art’ or the hand-painted ‘Horn Ok Please’, ‘Use...

    Applied Materials, CG Power, Lam Research, Larsen & Toubro, and Micron Join the IDTA

    The India Deep Tech Alliance (IDTA) announced that Applied...

    Manufacturing Breakthroughs in Chip Packaging Are Powering AI’s Future

    Courtesy: Lam Research With all the attention being given to...