HomeIndustryAerospace and DefenceWipro and EOS Made 3D Printed Components to Travel to Space for...

    Wipro and EOS Made 3D Printed Components to Travel to Space for ISRO

    3D printing major EOS and Wipro’s advanced manufacturing division have built the North-West Feed Cluster 2×2, India’s first Additive Manufacturing (AM) engineered component for ISRO. This component was a part of GSAT19 communications satellite for India.

    The satellite which was launched in June 2017 carried with itself technologies related to Feed Realization, 3D printed components along with hybrid CFRP technology on ISRO safelights. “This is the 1st AM product/ part used by ISRO to fly. The part used is called the ‘Feed Cluster’. Traditionally the feed cluster used to be built of more than one part. However, this product was redesigned to make it lighter and customized for a single part, “says Ajay Parikh, Business Head, Wipro 3D.

    Anand Prakasam, Country Manager- EOS India says that this is India’s first 3D printed functional metal component. Labelled the North-West Feed Cluster 2×2 (GS19), the component was designed by the Space Application Centre, Indian Space Research Organization (ISRO), and then used EOS Additive Manufacturing technologies in close collaboration with ISRO Scientists & Wipro 3D. The component has cleared various tests and validations, including Assembly Vibration Test, Climatic Test, and RF Tests before it took flight.

    The material used for manufacturing is Aluminium.

    He says that they are making tremendous progress in Additive manufacturing for the aerospace industry and points out those 3D printed parts cost effective as satellites components. “We have reduced assembly parts which result in RF leakage. Moreover, the transmission is also effective and there is a significant push towards weight reduction.

    Anand also mentions that they had first given a prototype 5 years ago and ISRO had taken 2 years to do develop the first prototype.

    For every gram of reduced weight, they can add more fuel to the device. “Also the components printed have been done in smaller parts. “The entire lifecycle of component and design took us around 4 weeks to develop the first prototype. “Certain complex post processing may add a few days. However, post the initial developmental stage, we could churn out two per week.”

    This is a significant step in EOS’s journey as it establishes the technology’s capability in developing and proving out mission-ready metal AM functional components that are part of the satellite’s core application. The component with a height of approx 320 mm and wall thickness of 2 mm poses significant challenges when it comes to realization through current standard metal AM systems.

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Tobii and STMicroelectronics enter mass production of breakthrough interior sensing technology

    Tobii and STMicroelectronics announced the beginning of mass production...

    Rohde & Schwarz unveils compact MXO 3 oscilloscopes with 4 and 8 channels

    Rohde & Schwarz expands its next-generation MXO oscilloscope portfolio...

    TI’s new power-management solutions enable scalable AI infrastructures

    Texas Instruments (TI) debuted new design resources and power-management...

    ESA awards Rohde & Schwarz for contributions to 30 years European Satellite Navigation

    The event brought together institutional and industrial partners, ESA...

    STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption

    STMicroelectronics, a global semiconductor leader serving customers across the...

    STARLight Project chosen as the European consortium to lead in next-gen silicon photonics on 300 mm wafers

    The STARLight project is bringing together a consortium of leading...

    KYOCERA AVX RELEASES NEW KGP SERIES STACKED CAPACITORS

    KYOCERA AVX released the new KGP Series commercial-grade stacked...

    Microchip Unveils First 3 nm PCIe Gen 6 Switch to Power Modern AI Infrastructure

    Switchtec Gen 6 PCIe Fanout Switches deliver extra bandwidth,...

    Nuvoton Launches Arbel NPCM8mnx System-in-Package (SiP) for AI Servers and Datacenter Infrastructure

    Breakthrough BMC Innovation Powers Secure, Scalable, and Open Compute...