HomeIndustryRohde & Schwarz to host Power Electronics Online Conference “From Design to Validation” in...

Rohde & Schwarz to host Power Electronics Online Conference “From Design to Validation” in May

Munich, April 21, 2026 — The power electronics market is being driven by stricter efficiency targets, higher power densities, and increasing integration with large-scale power grids. Consequently, engineers must cope with non-ideal component behavior, fast transient stresses on wide-bandgap devices, and ever more demanding EMC requirements. The conference will address these challenges by presenting measurement-centric solutions that can be implemented with modern oscilloscopes, vector network analyzers, and precision power analyzers.

The program opens on May 5 with a keynote by Tobias Keller (Hitachi Energy) entitled “Power Semiconductors: Shaping the Future Power Grid – Performance and Reliability for Future Decades”. Tobias Keller will discuss the qualification of silicon and silicon carbide (SiC) devices for high-voltage grid applications, focusing on thermal cycling, short-circuit robustness, and long-term reliability data.

A second keynote, delivered on May 6 by Veit Hellwig (Infineon Technologies), will examine the impact of gallium-nitride (GaN) technology on high-voltage motor inverter topologies.

In addition to the keynotes, the conference comprises a series of technical sessions. One presentation will analyze passive component characterization, highlighting methods for extracting parasitic inductance and capacitance at frequencies above 100 MHz and demonstrating the influence of these non-idealities on converter stability. Another session will detail automated dynamic characterization of SiC and GaN power devices, showing how double-pulse test rigs can be synchronized with high-speed digitizers to reduce measurement uncertainty and to capture fast recovery behavior.

Electromagnetic compatibility topics are covered in two dedicated talks. The first provides practical guidance on the use of near-field probes for pinpointing radiated emission sources and for validating the effectiveness of EMI filter designs. The second demonstrates a complete conducted emission measurement workflow on a small-scale prototype, using a Line Impedance Stabilization Network (LISN) together with a modern mixed signal oscilloscope. The presenter will also outline a filter design methodology that exploits the time-frequency capabilities of the instrument.

A further webinar addresses the growing need for accurate efficiency measurement in data center and AI server power supplies. By employing precision power analyzers capable of tracking distorted waveforms and rapid load transients, participants will learn how to obtain true input and output power values that satisfy 80 PLUS certification requirements.

The last session focuses on harmonic current and voltage flicker compliance for low-voltage, grid-connected products. The speaker will review the limits and test procedures defined in IEC/EN 61000-3-2/-3-3 and IEC/EN 61000-3-12/-3-11, and will demonstrate how integrated compliance testing software linked to a power analyzer can deliver automated pass/fail decisions from early prototype evaluation through to final type approval.

Speakers include subject matter experts from Rohde & Schwarz, Hitachi, Infineon, PE-Systems, Würth Elektronik, and the Universities of Bremen and Zaragoza. Their contributions combine academic insight with industrial experience, providing attendees with both theoretical background and hands-on measurement strategies.

The conference is free of charge, but registration is required. The full agenda, speaker biographies and the registration portal are available at: http://www.rohde-schwarz.com/power-electronics-conference

Related News

Must Read

Sasken Announces Hyderabad Center of Excellence to Scale Product Engineering and Digital Innovation

Hyderabad, India: April 16, 2026: Sasken Technologies Ltd. (BSE:...

Mission accomplished: Infineon technology proves reliable once again in space on Artemis II

Infineon's radiation-hardened semiconductors performed flawlessly on NASA's Artemis...

Bosch and Qualcomm expand collaboration to strategic ADAS solutions

Cockpit Computers: 10 million units delivered • High-performance solutions: Bosch...

Gartner Forecasts Worldwide Semiconductor Revenue to Exceed $1.3 Trillion in 2026

Semiconductor Revenue to Grow 64% in 2026 DRAM...

Directed Energy Systems: Where Capability Ends and Control Begins

by Sukhendu Deb Roy, Industry Consultant Key Takeaways The economics...

Boundary scan in combination with automotive applications for CAN-FD and LIN bus

Serial communication remains the backbone of electronic communication in...