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COMPUTEX 2017: Global Personal integration Support Simplifies OEMs’ Embedded Computing Woes

Also impressive is the new SMARC 2.0 computer-on-module demonstration on the basis of Intel Atom, Celeron and Pentium processors (codename Apollo Lake) where congatec presents the implementation of fully featured USB Type C connectivity with USB 3.1, power and graphics. With this universally applicable form of plug & play functionality, congatec greatly simplifies the use of embedded technology. Fully featured USB-C jacks are still rare and present a real breakthrough for standardizing the fragmented world of cable-based external interconnects. Such standardization is very beneficial for system engineers as well as system integrators, administrators and device users.

A highlight for the high-end embedded and edge sever sectors are the new COM Express Type 7 based server-on-modules offering server-grade performance and functionality with their Intel Xeon D processors, 2x 10 GbE and 32 PCIe lanes. The latter can be used for powerful intra system expansions such as GPGPUs and NVMe based ultra-fast storage devices as well as multi-module configurations on one single carrier board for high performance computing (HPC) designs. Application areas for the server-on-modules can be found in various scenarios from IT and carrier-grade server farms and cloudlets to edge, fog and Industry 4.0 servers.

congatec also showcases its broad portfolio of embedded boards and modules based on the latest Intel Atom, Celeron and Pentium processors (codename Apollo Lake) and Intel Core processors (codename Kaby Lake) offering comprehensive off-the-shelf driver support for various industries and communication demands – including cash and payment protocol support for kiosk systems. This is one of the many distinctive benefits separating congatec’s offerings from competitive board level products that often don’t have such a broad footprint in the various smart device and machine building industries.

The new congatec Cloud API (Application Programming Interface) that is designed for IoT gateways and edge servers rounds off the innovations displayed by the German provider of boards, modules and embedded design and manufacturing services. This API is made available to become the universal hub between local sensor networks and the IoT clouds. congatec’s new Cloud API for IoT Gateways communicates with local smart sensors, processes and converts the acquired data and executes automated actions based on a local rule engine, reducing traffic to the IoT cloud and enabling fast local actions. Secure bidirectional data exchange with any suitable clouds is achieved by using the TLS secured MQTT protocol. Clients can access this cloud via https in client or administrator mode. All these features make the new congatec Cloud API for IoT Gateways an ideal starting point for OEMs that wish to access smart sensor networks via IoT gateways and IoT edge servers on the basis of congatec’s comprehensive boards and module offerings ranging from COM Express, Qseven and SMARC modules to Pico-ITX and Mini-ITX motherboards plus various designs on IoT gateway level. Custom specific configurations of the congatec cloud API can be made available by congatec’s Embedded Design & Manufacturing Services (EDMS).

More information visit: www.congatec.com

ELE Times Bureau
ELE Times Bureauhttps://www.eletimes.ai/
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