HomeIndustryAerospace and DefenceWarfare more challenging with new technologies: IAF Chief

    Warfare more challenging with new technologies: IAF Chief

    Air Chief Marshal Rakesh Kumar Singh Bhadauria on Wednesday said the nature of warfare had changed significantly in the last few years. The advent of new technologies and cross-linking of ‘physical’, ‘digital’ and ‘cognitive’ domains had complicated warfighting.

    He was addressing military delegates of more than 50 countries at Aero India here at the special conclave.

    The topic of the conclave was to address technological advances, changing threat matrix and evolution of airpower.

    The exponential technological progress made in the last few years has made the realm of warfare more complex. “The low cost and easy availability of simple disruptive technology like drones with small state and non-state actors have made them more lethal, agile and capable of generating disproportionate effects,” the IAF Chief said. The IAF was closely observing unmanned, manned-unmanned teaming and anti-drone technologies, he said.

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides extensive global coverage of Electronics, Technology and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads and market your products favourably.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    TI’s new power-management solutions enable scalable AI infrastructures

    Texas Instruments (TI) debuted new design resources and power-management...

    ESA awards Rohde & Schwarz for contributions to 30 years European Satellite Navigation

    The event brought together institutional and industrial partners, ESA...

    STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption

    STMicroelectronics, a global semiconductor leader serving customers across the...

    STARLight Project chosen as the European consortium to lead in next-gen silicon photonics on 300 mm wafers

    The STARLight project is bringing together a consortium of leading...

    KYOCERA AVX RELEASES NEW KGP SERIES STACKED CAPACITORS

    KYOCERA AVX released the new KGP Series commercial-grade stacked...

    Microchip Unveils First 3 nm PCIe Gen 6 Switch to Power Modern AI Infrastructure

    Switchtec Gen 6 PCIe Fanout Switches deliver extra bandwidth,...

    Nuvoton Launches Arbel NPCM8mnx System-in-Package (SiP) for AI Servers and Datacenter Infrastructure

    Breakthrough BMC Innovation Powers Secure, Scalable, and Open Compute...

    NEPCON ASIA 2025: Showcasing the Future of Smart Electronics Manufacturing

    NEPCON ASIA 2025, taking place from October 28 to...

    Renesas Expands Sensing Portfolio with 3 Magnet-Free IPS ICs & Web-Based Design Tool

    New Simulation & Optimization Platform Enables Custom Coil Designs...

    IEEE IEDM, 2025 Showcases Latest Technologies in Microelectronics, Themed “100 Years of FETs”

    The IEEE International Electron Devices Meeting (IEDM) is considered...