HomeNewsIndia NewsNew AE-CLOUD2 Kit Speeds Global LTE IoT Connectivity Development

    New AE-CLOUD2 Kit Speeds Global LTE IoT Connectivity Development

    Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced the Renesas Synergy AE-CLOUD2 kit, a complete hardware and software reference design that allows embedded developers to quickly evaluate cellular connectivity options and build Low Power Wide Area (LPWA) cellular Internet of Things (IoT) applications.

    The AE-CLOUD2 kit together with the new Synergy Software Package (SSP) version 1.5.0 simplifies connecting IoT sensor devices to enterprise cloud services using 4G/LTE Cat-M1 and Cat-NB1, also called NB-IoT, with fallback to 2G/EGPRS cellular networks. The kit’s rich functionality accelerates prototyping cellular-enabled IoT devices for asset tracking, retail and agriculture monitoring, smart cities/utilities, mobile healthcare, and industrial automation.

    “Renesas is the first MCU supplier to deliver a 4G/LTE Cat-M1/Cat-NB1-based reference design kit that is certified to operate globally, uses Wi-Fi and Ethernet, and offers cloud service example projects. The kit’s wide array of sensors, global cellular modem, and GPS capability opens the door to countless IoT monitoring and control applications for deployment on a broad scale,” said Daryl Khoo, Vice President Product Marketing, IoT Platform Business Division, Renesas Electronics Corporation.

    Key Features of AE-CLOUD2 Kit

    •  Synergy S5D9 MCU baseboard.

    • Quectel ultra-low power BG96 cellular module supports 4G/LTE Cat-M1, Cat-NB1, and 2G/EGPRS.
    • Sensors for sampling and sending measurement data to the cloud:
      • Renesas ISL29035 digital light sensor for ambient/infrared light measurement o Bosch BMI160 MEMS sensor for acceleration and gyroscopic measurement o Bosch BMM150 MEMS three-axis geomagnetic sensor for compass navigation o Bosch BME680 MEMS sensor for gas, temperature, humidity, and pressure measurements.
      • Knowles SPM0687LR5H-1 analog microphone for sound and voice capture.

    Key Features of SSP version 1.5.0

    • Customizable production grade software.
    • ThreadX real-time-operating system (RTOS).
    • NetX Duo Message Queue Telemetry Transport (MQTT) and NetX Secure Transport Layer Security (TLS) for secure communications with cloud services.
    • Support for HTTPS Client and HTTP 1.1 Client.
    • Wireless Frameworks for connecting to LTE IoT networks and cloud services.
    • SSP Cellular Framework provides APIs to provision, configure and communicate with cellular network for data communication.
    • Example projects for Amazon, Microsoft, Google, and Medium One, including reference code and instructions for connecting AE-CLOUD2 to each cloud service using Ethernet, Wi-Fi, or LTE IoT cellular.

    Renesas is demonstrating the AE-CLOUD2 kit in booth 727 at Arm TechCon, October 17-18, 2018, San Jose Convention Center.

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Open World Foundation Models Generate Synthetic Worlds for Physical AI Development

    Courtesy: Nvidia Physical AI Models- which power robots, autonomous...

    Electronics manufacturing and exports grow manifold in the last 11 years

    Central government-led schemes, including PLI for large-scale electronics manufacturing...

    Taiwanese company to invest 1,000 crore in Karnataka for new electronics & semiconductor park

    Allegiance Group signed a Memorandum of Understanding (MoU) with...

    The 2025 MRAM Global Innovation Forum will Showcase MRAM Technology Innovations, Advances, & Research from Industry Experts

    The MRAM Global Innovation Forum is the industry’s premier platform for...

    The Era of Engineering Physical AI

    Courtesy: Synopsys Despite algorithmic wizardry and unprecedented scale, the engineering...

    Gartner Forecasts Having 116 Million EVs on the Road in 2026

    Gartner, Inc., a business and technology insights company predicts...

    Toradex Launches Two New Computer on Module Families for Ultra-Compact Industrial and IoT Applications

    Toradex has expanded its embedded computing portfolio with four...

    The Great Leap: How AI is Reshaping Cybersecurity from Pilot Projects to Predictive Defense

    Imagine your cybersecurity team as a group of highly-trained...