Electronics

Highly Reliable Z-axis Compression CIN::APSE Connectors from Cinch now Available Through Powell Electronics

Unique, Z-axis compression CIN::APSE interconnects from Cinch providing superior mechanical and electrical performance under the most extreme mechanical shock and vibration conditions, can now...

A Proven Range of Motion Detection: Panasonic Industry’s Inertial Sensor in Vehicle Engineering

It has become an essential prerequisite in times of the ongoing “electrification of everything”: Cars, motorbikes, autonomous buses, construction machines, and many others will...

Ensure Reliable Performance With SMA Interconnect Designed For Extreme Exposure

Amphenol RF is pleased to expand our line of extreme exposure RF interconnect with an additional SMA bulkhead jack. This connector is a waterproof,...

Pasternack Expands Series of 12G SDI Cables, Connectors

Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave, and millimeter-wave products, has broadened its line of highly reliable 12G SDI...

OMRON to Continue its Strong Focus towards Indian Packaging Machine Makers with Innovative- Automation...

Reiterating its commitment towards its vision of “Enriching the Future for People, Industries and the Globe by innovative-Automation”, OMRON is on its way to...

AAEON’s UP Xtreme i12 Offers up to 20% Greater CPU Performance

Improving upon the 11th Generation Intel Core Processor SoC of its predecessor, the UP Xtreme i11, AAEON’s next-generation UP Xtreme i12 utilizes the 12-core,...

Ashwini Vaishnaw sets up 6 task forces to develop component ecosystem

Telecom Minister Ashwini Vaishnaw informed that a total of six task forces have been set up to develop the component ecosystem. He made this...

Radiation-Tolerant Power Electronic Systems are Hard to Design

Electronic systems in space are exposed to many hazards. Among other things, without the Earth’s protective magnetic field deflecting particles and our atmospheric blanket...

Jindal Stainless ropes in ReNew Power for 300 MW Hybrid Power Project

Leading stainless player Jindal Stainless Limited (JSL) has partnered with ReNew Power to develop its proposed 300 MW hybrid energy project. The project will generate...

Hexagon introduces Elements to help Engineers Design increasingly Complex Products with System-level Modelling

Hexagon’s Manufacturing Intelligence division has today introduced Elements, new simulation software that helps engineering teams understand the behaviour of systems that are becoming increasingly...

iWave Systems releases the world’s first PCIe to SD bridge module in M.2 type 2280...

iWave Systems announces its all-new PCIe to SD bridge module in M.2 form factor, featuring flexible integration and excellent compatibility with existing infrastructures. M.2, an...

STMicroelectronics and Soitec cooperate on SiC substrate manufacturing technology

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Soitec (Euronext Paris), a leader in designing and manufacturing innovative...

ROHM and BASiC Semiconductor Form a Strategic Partnership

Shenzhen BASiC Semiconductor and ROHM have entered into a strategic partnership agreement on SiC power devices for automotive applications. A signing ceremony was held...

Electronics Miniaturisation Race – Transistors and Chiplets

Chiplet technology is an older concept that has very recently gained prominence in the tech world. We are living in very promising times when it...

ROHM Develops Ultra-Low-Power On-Device Learning Edge AI Chip

ROHM has developed an on-device learning AI chip (SoC with on-device learning AI accelerator) for edge computer endpoints in the IoT field. It utilizes...

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