HomeElectronicsNew 62mm package in Infineon’s CoolSiC portfolio helps engineers to achieve higher...

    New 62mm package in Infineon’s CoolSiC portfolio helps engineers to achieve higher efficiency and power density

    Infineon Technologies has announced the expansion of its CoolSiC 1200 V and 2000 V MOSFET module families with a new industry-standard package. The proven 62mm device is designed in half-bridge topology and is based on the recently introduced and advanced M1H silicon carbide (SiC) MOSFET technology. The package enables the use of SiC for mid-power applications from 250 kW – where silicon reaches the limits of power density with IGBT technology. Compared to a 62mm IGBT module, the list of applications now additionally includes solar, server, energy storage, EV charger, traction, commercial induction cooking, and power conversion systems.

    The M1H technology enables a significantly wider gate voltage window, ensuring high robustness to the driver and layout-induced voltage spikes at the gate without any restrictions even at high switching frequencies. In addition to that, very low switching and transmission losses minimize cooling requirements. Combined with a high reverse voltage, these devices meet another requirement of modern system design. By using Infineon’s CoolSiC chip technology, converter designs can be made more efficient, the nominal power per inverter can be increased and system costs can be reduced.

    With baseplate and screw connections, the package features a very rugged mechanical design optimized for the highest system availability, minimum service costs, and downtime losses. Outstanding reliability is achieved through high thermal cycling capability and a continuous operating temperature (Tvjop) of 150°C. The symmetrical internal package design provides identical switching conditions for the upper and lower switches. Optionally, the thermal performance of the module can be further enhanced with pre-applied thermal interface material (TIM).

    Availability

    The CoolSiC 62mm package MOSFETs are available in 1200 V variants of 5 mΩ/180 A, 2 mΩ/420 A, and 1 mΩ/560 A. The 2000 V portfolio will include the 4 mΩ/300 A and 3 mΩ/400 A variants. The portfolio will be completed in Q1 2024 with the 1200 V/3 mΩ and 2000 V/5 mΩ variants. An evaluation board is available for rapid characterization of the modules (double pulse/continuous operation). For ease of use, it provides flexible adjustment of the gate voltage and gate resistors. At the same time, it can be used as a reference design for driver boards for volume production.

    ELE Times Report
    ELE Times Reporthttps://www.eletimes.ai/
    ELE Times provides extensive global coverage of Electronics, Technology and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads and market your products favourably.

    Related News

    Must Read

    ECMS applications make history, cross Rs. 1 lakh crore in investment applications

    Union Minister for Electronics and IT Ashwini Vaishnaw announced...

    AI-Driven 6G: Smarter Design, Faster Validation

    Courtesy: Keysight Technologies Key takeaways: Telecom companies are hoping...

    Scaling up the Smart Manufacturing Mountain

    Courtesy: Rockwell Automation A step-by-step roadmap to adopting smart manufacturing...

    STMicroelectronics’ new GaN ICs platform for motion control boosts appliance energy ratings

    STMicroelectronics unveiled new smart power components that let home...

    Keysight Hosts AI Thought Leadership Conclave in Bengaluru

     Keysight Technologies, Inc. announced the AI Thought Leadership Conclave, a...

    Government approves 17 projects worth Rs. 7,172 crore under ECMS

    The Ministry of Electronics and IT announced for the...

    BD Soft strengthens cybersecurity offerings for BFSI and Fintech businesses with advanced solutions

    BD Software Distribution Pvt. Ltd. has expanded its Managed...

    Advancing Quantum Computing R&D through Simulation

    Courtesy: Synopsys Even as we push forward into new frontiers...

    Overcoming BEOL Patterning Challenges at the 3-NM Node

    Courtesy: Lam Research ● Controlling critical process parameters is key...