Electronics

Anritsu & HEAD Launch Acoustic Evaluation Solution for Next-Gen Automotive eCall Systems

ANRITSU CORPORATION and HEAD acoustics have jointly launched of an advanced acoustic evaluation solution for next-generation automotive emergency call systems (“NG eCall”). The new solution...

NAL-CSIR Advances Field testing of Indigenous Defence Tech

The Council of Scientific and Industrial Research (CSIR)-National Aerospace Laboratories (NAL), in collaboration with Solar Defence & Aerospace Ltd. (SDAL), a private industry partner...

Nissan Powering EV Component Plant with Repurposed Batteries

Nissan Australia has launched the Nissan Node project, a circular economy initiative which will repurpose end-of-life Nissan Leaf batteries to power a section of...

FAMES Pilot Line R&D Advances: 400°C CMOS Enables 3D Integration Goals

CEA-Leti, the coordinator of the FAMES Pilot line, has achieved a major milestone for next-generation chip stacking: fully functional 2.5 V SOI CMOS devices fabricated...

USB-IF Hardware Certification to Anritsu for USB4 2.0 Test Solution

ANRITSU CORPORATION gets certified by the USB Implementers Forum (USB-IF) for its test solution for the latest USB4 Version 2.0 (USB4 v2) communication standard. The solution...

As Energy-Efficient Chips Are Rising — HCLTech × Dolphin’s New Partnership Gives the Trend a...

Amid the ongoing push, HCLTech & Dolphin Semiconductors have announced a strategic partnership aiming to develop energy-efficient chips for IoT and data centre applications....

Advanced GAA Chips: Minimizing Voltage Loss and Improving Yield

Courtesy: Lam Research As advanced logic chips decrease in size, voltage loss can increase An emerging solution is backside power delivery networks that use...

Revamping a Solid-State Battery Cell

Courtesy: Comsol Ever experience these common annoyances? You’re about to leave for the day and realize you forgot to charge your phone. Or, you’re on...

Serrated Edges: For Less Noise and Improved Fan Performance

Courtesy: Cadence Understanding Noise Reduction in Industrial Fans Industrial fans are widely utilized across various sectors, including manufacturing, automotive, and energy production, playing a vital role...

Kyocera and Rohde & Schwarz’s multipurpose phased array antenna module (PAAM) at CES 2026

Kyocera and Rohde & Schwarz will demonstrate the characterization of Kyocera’s novel phased array antenna module (PAAM) at CES 2026 in Las Vegas, NV....

CEA-Leti & STMicroelectronics’ Demonstrate Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration...

CEA-Leti and STMicroelectronics showcased key enablers for a new high-performance and versatile RF Si platform cointegrating best-in-class active and passive devices used in RF...

Beyond the Bill: How AI-Enabled Smart Meters Are Driving Lead Time Optimization and Supply Chain...

Introduction Smart meters have significantly evolved since their initial implementation for consumer billing. In the contemporary networked industrial landscape, where semiconductor fabrication facilities, data centers,...

Inside the Digital Twin: How AI is Building Virtual Fabs to Prevent Trillion-Dollar Mistakes

Introduction Semiconductor manufacturing often feels like modern alchemy: billions of tiny transistors squeezed onto a chip smaller than a fingernail, stitched through thousands of precise...

STMicroelectronics streamlines smart-home device integration with industry-first Matter NFC chip

STMicroelectronics has unveiled a secure NFC chip designed to make home networks faster and easier to install and scale, leveraging the latest Matter smart-home...

Mitsubishi Electric India to Showcase Breakthrough Power Semiconductor Technologies at PCIM India 2025

Mitsubishi Electric India, is set to introduce its flagship cutting edge Power Semiconductor Devices and technology to the Indian market. MEI Participation in PCIM...

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