HomeIndustryAerospace and DefenceIndia, US to Work for Stronger Defense Ties

    India, US to Work for Stronger Defense Ties

    The US will discuss with India the need to “operationalise their major defence partnership”, besides including defence trade and cooperation in new domains like robotics and artificial intelligence as thrust areas.

    US Defence Secretary General Lloyd Austin will be in India from March 19-21. He is scheduled to meet his counterpart Rajnath Singh. He is expected to bring along a few top industry leaders.

    Operationalising the partnership would mean a deeper engagement, a greater information sharing and the US allowing India access to cutting-edge technology in robotics, artificial intelligence, armed drones and even unmanned fighter jets.

    At present, India and US are running separate programmes for making unmanned jets.

    Since 2008, the US has authorised defence equipment sales worth $20 billion to India. The latest is India’s proposed purchase of 30 armed drones of the “predator-family” from US firm General Atomics.

    Since the late 1990s, both nations have been entering into such agreements. A generic formulation was agreed in 2009 for all future supplies that India chooses to procure to give predictability in what was otherwise an ad hoc case-by-case arrangement for the procurement of defence technology and equipment from the US.

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    USB-IF Hardware Certification to Anritsu for USB4 2.0 Test Solution

    ANRITSU CORPORATION gets certified by the USB Implementers Forum...

    Advanced GAA Chips: Minimizing Voltage Loss and Improving Yield

    Courtesy: Lam Research As advanced logic chips decrease in...

    The Leading Five Essential Context Window Concepts In LLMs

    Courtesy: Micron This story outlines five essential concepts that explain...

    Revamping a Solid-State Battery Cell

    Courtesy: Comsol Ever experience these common annoyances? You’re about to...

    The Rise of Smart Audio: From Sound to Intelligence

    Courtesy: Infineon What if your fridge warned you before it...

    Serrated Edges: For Less Noise and Improved Fan Performance

    Courtesy: Cadence Understanding Noise Reduction in Industrial Fans Industrial fans are...

    Kyocera and Rohde & Schwarz’s multipurpose phased array antenna module (PAAM) at CES 2026

    Kyocera and Rohde & Schwarz will demonstrate the characterization...

    AI PCs: What Tata Electronics and Intel Aim to Scale in India

    Tata Electronics, a global enterprise headquartered in India, and...